Voice, data and rf integrated circuit with off-chip power amplifier and methods for use therewith

ABSTRACT

An RFIC includes an RF transmitter, that generates an RF signal to a power amplifier module that operates a selected one of a plurality of power amplifiers, based one or more control signals. A processing module generates the control signals based on a selected one of a plurality of modes, wherein the plurality of modes include a first wireless mode corresponding to the use of the RFIC in accordance with a first wireless standard and a second wireless mode corresponding to the use of the RFIC in accordance with a second wireless standard. A power management circuit generates a plurality of power supply signals including at least one power supply signal for selectively powering only the selected one of the plurality of power amplifiers, in response to the at least one control signal, wherein the power management circuit is bonded to a bottom of the RFIC so as to dissipate heat to a printed circuit board.

CROSS REFERENCE TO RELATED PATENTS

The present application claims priority under 35 U.S.C. §120 as acontinuation of the co-pending application entitled, VOICE, DATA AND RFINTEGRATED CIRCUIT WITH OFF-CHIP POWER AMPLIFIER AND METHODS FOR USETHEREWITH, having Ser. No. 11/703,994 and filed on Feb. 8, 2007.

BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

This invention relates generally to mobile communication devices andmore particularly to a circuit for managing power in a combined voice,data and RF integrated circuit.

2. Description of Related Art

As is known, integrated circuits are used in a wide variety of productsincluding, but certainly not limited to, portable electronic devices,computers, computer networking equipment, home entertainment, automotivecontrols and features, and home appliances. As is also known, integratedcircuits include a plurality of circuits in a very small space toperform one or more fixed or programmable functions.

Power management can be an important consideration for electronicdevices, particularly for mobile devices that operate from batterypower. Lowering the power consumption of a device can increase batterylife, or conversely, can potentially decrease the size of the batterythat is required, with a corresponding decrease in weight and size.

The advantages of the present invention will be apparent to one skilledin the art when presented with the disclosure herein.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed to apparatus and methods of operationthat are further described in the following Brief Description of theDrawings, the Detailed Description of the Invention, and the claims.Other features and advantages of the present invention will becomeapparent from the following detailed description of the invention madewith reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present invention;

FIG. 2 is a schematic block diagram of an embodiment of anothercommunication system in accordance with the present invention;

FIG. 3 is a schematic block diagram of an embodiment of an integratedcircuit in accordance with the present invention;

FIG. 4 is a schematic block diagram of another embodiment of anintegrated circuit in accordance with the present invention;

FIG. 5 is a schematic block diagram of an embodiment of an RFtransceiver in accordance with the present invention;

FIG. 6 is a schematic block diagram of an embodiment of a radiotransmitter front-end and power amplifier module in accordance with thepresent invention;

FIG. 7 is a schematic block diagram of another embodiment of a radiotransmitter front-end and power amplifier module in accordance with thepresent invention;

FIG. 8 is a schematic block diagram of an embodiment of power managementcircuitry in accordance with the present invention;

FIG. 9 is a schematic block diagram of another embodiment of powermanagement circuitry in accordance with the present invention;

FIG. 10 is a side view of a pictorial representation of an integratedcircuit package in accordance with the present invention.

FIG. 11 is a bottom view of a pictorial representation of an integratedcircuit package in accordance with the present invention.

FIG. 12 is a flow chart of an embodiment of a method in accordance withthe present invention;

FIG. 13 is a flow chart of an embodiment of a method in accordance withthe present invention;

FIG. 14 is a flow chart of an embodiment of a method in accordance withthe present invention;

FIG. 15 is a flow chart of an embodiment of a method in accordance withthe present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present invention. In particular acommunication system is shown that includes a communication device 10that communicates real-time data 24 and non-real-time data 26 wirelesslywith one or more other devices such as base station 18, non-real-timedevice 20, real-time device 22, and non-real-time and/or real-timedevice 24. In addition, communication device 10 can also optionallycommunicate over a wireline connection with non-real-time device 12,real-time device 14 and non-real-time and/or real-time device 16.

In an embodiment of the present invention the wireline connection 28 canbe a wired connection that operates in accordance with one or morestandard protocols, such as a universal serial bus (USB), Institute ofElectrical and Electronics Engineers (IEEE) 488, IEEE 1394 (Firewire),Ethernet, small computer system interface (SCSI), serial or paralleladvanced technology attachment (SATA or PATA), or other wiredcommunication protocol, either standard or proprietary. The wirelessconnection can communicate in accordance with a wireless networkprotocol such as IEEE 802.11, Bluetooth, Ultra-Wideband (UWB), WIMAX, orother wireless network protocol, a wireless telephony data/voiceprotocol such as Global System for Mobile Communications (GSM), GeneralPacket Radio Service (GPRS), Enhanced Data Rates for Global Evolution(EDGE), Personal Communication Services (PCS), or other mobile wirelessprotocol or other wireless communication protocol, either standard orproprietary. Further, the wireless communication path can includeseparate transmit and receive paths that use separate carrierfrequencies and/or separate frequency channels. Alternatively, a singlefrequency or frequency channel can be used to bi-directionallycommunicate data to and from the communication device 10.

Communication device 10 can be a mobile phone such as a cellulartelephone, a personal digital assistant, game console, personalcomputer, laptop computer, or other device that performs one or morefunctions that include communication of voice and/or data via wirelineconnection 28 and/or the wireless communication path. In an embodimentof the present invention, the real-time and non-real-time devices 12, 1416, 18, 20, 22 and 24 can be personal computers, laptops, PDAs, mobilephones, such as cellular telephones, devices equipped with wirelesslocal area network or Bluetooth transceivers, FM tuners, TV tuners,digital cameras, digital camcorders, or other devices that eitherproduce, process or use audio, video signals or other data orcommunications.

In operation, the communication device includes one or more applicationsthat include voice communications such as standard telephonyapplications, voice-over-Internet Protocol (VoIP) applications, localgaming, Internet gaming, email, instant messaging, multimedia messaging,web browsing, audio/video recording, audio/video playback, audio/videodownloading, playing of streaming audio/video, office applications suchas databases, spreadsheets, word processing, presentation creation andprocessing and other voice and data applications. In conjunction withthese applications, the real-time data 26 includes voice, audio, videoand multimedia applications including Internet gaming, etc. Thenon-real-time data 24 includes text messaging, email, web browsing, fileuploading and downloading, etc.

In an embodiment of the present invention, the communication device 10includes an integrated circuit, such as a combined voice, data and RFintegrated circuit that includes one or more features or functions ofthe present invention. Such integrated circuits shall be described ingreater detail in association with FIGS. 3-14 that follow.

FIG. 2 is a schematic block diagram of an embodiment of anothercommunication system in accordance with the present invention. Inparticular, FIG. 2 presents a communication system that includes manycommon elements of FIG. 1 that are referred to by common referencenumerals. Communication device 30 is similar to communication device 10and is capable of any of the applications, functions and featuresattributed to communication device 10, as discussed in conjunction withFIG. 1. However, communication device 30 includes two separate wirelesstransceivers for communicating, contemporaneously, via two or morewireless communication protocols with data device 32 and/or data basestation 34 via RF data 40 and voice base station 36 and/or voice device38 via RF voice signals 42.

FIG. 3 is a schematic block diagram of an embodiment of an integratedcircuit in accordance with the present invention. In particular, a voicedata RF integrated circuit (IC) 50 is shown that implementscommunication device 10 in conjunction with microphone 60,keypad/keyboard 58, memory 54, speaker 62, display 56, camera 76,antenna interface 52 and wireline port 64. In addition, voice data RF IC50 includes a transceiver 73 with RF and baseband modules for formattingand modulating data and voice signals into RF real-time data 26 andnon-real-time data 24 and transmitting this data via an off-chip poweramplifier module 80 and antenna interface 72 and an antenna, and forreceiving RF data and RF voice signals via the antenna. Further, voicedata RF IC 50 includes an input/output module 71 with appropriateencoders and decoders for communicating via the wireline connection 28via wireline port 64, an optional memory interface for communicatingwith off-chip memory 54, a codec for encoding voice signals frommicrophone 60 into digital voice signals, a keypad/keyboard interfacefor generating data from keypad/keyboard 58 in response to the actionsof a user, a display driver for driving display 56, such as by renderinga color video signal, text, graphics, or other display data, and anaudio driver such as an audio amplifier for driving speaker 62 and oneor more other interfaces, such as for interfacing with the camera 76 orthe other peripheral devices.

Off-chip power management circuit 95 includes one or more DC-DCconverters, voltage regulators, current regulators or other powersupplies for supplying the voice data RF IC 50 and optionally the othercomponents of communication device 10 and/or its peripheral devices withsupply voltages and or currents (collectively power supply signals) thatmay be required to power these devices. Off-chip power managementcircuit 95 can operate from one or more batteries, line power and/orfrom other power sources, not shown. In particular, off-chip powermanagement module can selectively supply power supply signals ofdifferent voltages, currents or current limits or with adjustablevoltages, currents or current limits in response to power mode signalsreceived from the voice data RF IC 50. Voice Data RF IC 50 optionallyincludes an on-chip power management circuit 95′ for replacing theoff-chip power management circuit 95.

In an embodiment of the present invention, the voice data RF IC 50 is asystem on a chip integrated circuit that includes at least oneprocessing device. Such a processing device, for instance, processingmodule 225, may be a microprocessor, micro-controller, digital signalprocessor, microcomputer, central processing unit, field programmablegate array, programmable logic device, state machine, logic circuitry,analog circuitry, digital circuitry, and/or any device that manipulatessignals (analog and/or digital) based on operational instructions. Theassociated memory may be a single memory device or a plurality of memorydevices that are either on-chip or off-chip such as memory 54. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, and/or any device that stores digital information. Note thatwhen the Voice Data RF IC 50 implements one or more of its functions viaa state machine, analog circuitry, digital circuitry, and/or logiccircuitry, the associated memory storing the corresponding operationalinstructions for this circuitry is embedded with the circuitrycomprising the state machine, analog circuitry, digital circuitry,and/or logic circuitry.

In operation, the voice data RF IC 50 executes operational instructionsthat implement one or more of the applications (real-time ornon-real-time) attributed to communication devices 10 and 30 asdiscussed in conjunction with FIGS. 1 and 2. Further, RF IC 50 includesoff-chip power amplifier control features in accordance with the presentinvention that will be discussed in greater detail in association withFIG. 5.

FIG. 4 is a schematic block diagram of another embodiment of anintegrated circuit in accordance with the present invention. Inparticular, FIG. 4 presents a communication device 30 that includes manycommon elements of FIG. 3 that are referred to by common referencenumerals. Voice data RF IC 70 is similar to voice data RF IC 50 and iscapable of any of the applications, functions and features attributed tovoice data RF IC 50 as discussed in conjunction with FIG. 3. However,voice data RF IC 70 includes two separate wireless transceivers 73 and75 for communicating, contemporaneously, via two or more wirelesscommunication protocols via RF data 40 and RF voice signals 42.

In operation, the voice data RF IC 70 executes operational instructionsthat implement one or more of the applications (real-time ornon-real-time) attributed to communication device 10 as discussed inconjunction with FIG. 1. Further, RF IC 70 includes off-chip poweramplifier control features in accordance with the present invention thatwill be discussed in greater detail in association with FIG. 5.

FIG. 5 is a schematic block diagram of an RF transceiver 125, such astransceiver 73 or 75, which may be incorporated in communication devices10 and/or 30. The RF transceiver 125 includes an RF transmitter 129, anRF receiver 127 coupled to the processing module 225. The RF receiver127 includes a RF front end 140, a down conversion module 142, and areceiver processing module 144. The RF transmitter 129 includes atransmitter processing module 146, an up conversion module 148, and aradio transmitter front-end 150.

As shown, the transmitter is coupled to an antenna through an off-chippower amplifier module 180, off-chip antenna interface 171 and adiplexer (duplexer) 177, that couples the transmit signal 155 to theantenna to produce outbound RF signal 170 and couples inbound RF signal152 to produce received signal 153. While a diplexer is shown a transmitreceive switch could likewise be employed for the same purpose. While asingle antenna is represented, the receiver and transmitter may eachemploy separate antennas or share a multiple antenna structure thatincludes two or more antennas. In another embodiment, the receiver andtransmitter may share a multiple input multiple output (MIMO) antennastructure that includes a plurality of antennas. Each antenna may befixed, programmable, an antenna array or other antenna configuration.Accordingly, the antenna structure of the wireless transceiver couldalso depend on the particular standard(s) to which the wirelesstransceiver is compliant and the applications thereof.

In operation, the transmitter receives outbound data 162 from a hostdevice or other source via the transmitter processing module 146. Thetransmitter processing module 146 processes the outbound data 162 inaccordance with a particular wireless communication standard (e.g., IEEE802.11, Bluetooth, RFID, GSM, CDMA, et cetera) to produce baseband orlow intermediate frequency (IF) transmit (TX) signals 164. The basebandor low IF TX signals 164 may be digital baseband signals (e.g., have azero IF) or digital low IF signals, where the low IF typically will bein a frequency range of one hundred kilohertz to a few megahertz. Notethat the processing performed by the transmitter processing module 146includes, but is not limited to, scrambling, encoding, puncturing,mapping, modulation, and/or digital baseband to IF conversion. Furthernote that the transmitter processing module 146 may be implemented usinga shared processing device, individual processing devices, or aplurality of processing devices and may further include memory. Such aprocessing device may be a microprocessor, micro-controller, digitalsignal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on operationalinstructions. The memory may be a single memory device or a plurality ofmemory devices. Such a memory device may be a read-only memory, randomaccess memory, volatile memory, non-volatile memory, static memory,dynamic memory, flash memory, and/or any device that stores digitalinformation. Note that when the processing module 146 implements one ormore of its functions via a state machine, analog circuitry, digitalcircuitry, and/or logic circuitry, the memory storing the correspondingoperational instructions is embedded with the circuitry comprising thestate machine, analog circuitry, digital circuitry, and/or logiccircuitry.

The up conversion module 148 includes a digital-to-analog conversion(DAC) module, a filtering and/or gain module, and a mixing section. TheDAC module converts the baseband or low IF TX signals 164 from thedigital domain to the analog domain. The filtering and/or gain modulefilters and/or adjusts the gain of the analog signals prior to providingit to the mixing section. The mixing section converts the analogbaseband or low IF signals into up converted signals 166 based on atransmitter local oscillation 168.

The radio transmitter front end 150 includes a driver for producing anRF signal 182 that drives off-chip power amplifier module 180, such aspower amplifier module 180 and may also include a transmit filtermodule. The power amplifier module 180 amplifies the RF signals 182 toproduce transmit signal 155 and ultimately outbound RF signals 170,which may be filtered by the transmitter filter module, if included. Theantenna structure transmits the outbound RF signals 170 to a targeteddevice such as a RF tag, base station, an access point and/or anotherwireless communication device via an antenna interface 171 coupled to anantenna that provides impedance matching and optional bandpass and/ornotch filtration.

The receiver receives inbound RF signals 152 via the antenna andoff-chip antenna interface 171 that operates to process the inbound RFsignal 152 into received signal 153 for the receiver front-end 140. Ingeneral, antenna interface 171 provides impedance matching of antenna tothe RF front-end 140 and optional bandpass and/or notch filtration ofthe inbound RF signal 152.

The down conversion module 70 includes a mixing section, an analog todigital conversion (ADC) module, and may also include a filtering and/orgain module. The mixing section converts the desired RF signal 154 intoa down converted signal 156 that is based on a receiver localoscillation 158, such as an analog baseband or low IF signal. The ADCmodule converts the analog baseband or low IF signal into a digitalbaseband or low IF signal. The filtering and/or gain module high passand/or low pass filters the digital baseband or low IF signal to producea baseband or low IF signal 156. Note that the ordering of the ADCmodule and filtering and/or gain module may be switched, such that thefiltering and/or gain module is an analog module.

The receiver processing module 144 processes the baseband or low IFsignal 156 in accordance with a particular wireless communicationstandard (e.g., IEEE 802.11, Bluetooth, RFID, GSM, CDMA, et cetera) toproduce inbound data 160. The processing performed by the receiverprocessing module 144 includes, but is not limited to, digitalintermediate frequency to baseband conversion, demodulation, demapping,depuncturing, decoding, and/or descrambling. Note that the receiverprocessing modules 144 may be implemented using a shared processingdevice, individual processing devices, or a plurality of processingdevices and may further include memory. Such a processing device may bea microprocessor, micro-controller, digital signal processor,microcomputer, central processing unit, field programmable gate array,programmable logic device, state machine, logic circuitry, analogcircuitry, digital circuitry, and/or any device that manipulates signals(analog and/or digital) based on operational instructions. The memorymay be a single memory device or a plurality of memory devices. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, and/or any device that stores digital information. Note thatwhen the receiver processing module 144 implements one or more of itsfunctions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory storing the corresponding operationalinstructions is embedded with the circuitry comprising the statemachine, analog circuitry, digital circuitry, and/or logic circuitry.

In operation, processing module 225 determines a selected one of theplurality of modes, such as based on current use characteristics of theat least one application, the particular application being executed,such as any of the applications discussed in conjunction withcommunication devices 10 or 30 or based on other factors defined by theoperational instructions being executed. In addition, processing module225 generates a control signal 169 based on the selected one of theplurality of modes.

In an embodiment of the present invention the plurality of modes cancorrespond to a plurality of power ranges such as a low power mode, amedium power mode, a high power mode, etc, and or a plurality of modesthat correspond to different wireless protocols, such as IEEE 802.11,Bluetooth, RFID, GSM, CDMA, EDGE, 3G, UMTS modes, and/or or other modesof operation. Th3 control signal 169 can include a power mode or othermode and be used by the radio transmitter front end 150 to generate biascontrol signals 196 to off-chip power amplifier module 180 to controlthe biasing of the power amplifier module 180 based on the particularmode, as will be discussed further in conjunction with FIGS. 6 & 7. Inaddition, the power amplifier configuration of power amplifier module180 can optionally be changed based on the mode indicated by the controlsignal or signals 169 as will be discussed further in conjunction withFIG. 7. Further, the power supply signals generated to power the poweramplifier module 180 can be modified in response to the control signals169 to adapt to the particular mode of operation, as will be discussedfurther in conjunction with FIGS. 6-9.

FIG. 6 is a schematic block diagram of an embodiment of a radiotransmitter front-end and power amplifier module in accordance with thepresent invention. In particular, radio transmitter front end 150includes a driver 192 for producing RF signal 182 in response toup-converted signal 166. Driver 192 can be designed to match the signalmagnitudes and impedance expected by off-chip power amplifier module197. A bias control generator 194 generates a bias control signal 196 inresponse to the control signal 169, to control the biasing of theoff-chip power amplifier module 197.

In an embodiment of the present invention, bias control generator 194responds to the mode, such as the power mode, the particular standard,or other mode of operation to adjust the biasing of the power amplifier190 of power amplifier module 197 to conform to the expected operationof the power amplifier 190. For example, power amplifier 190 can operatein a plurality of modes such as in a low, medium and high power mode,and/or GSM mode, EDGE mode, UMTS mode, etc. The supply voltage orcurrent limit of power supply signals 192 can be also be modified by thepower management circuit 95 or 95′ and/or additional power supplysignals 192 can be supplied, based on the selected mode of operation. Ahigh current limit and/or high voltage can correspond to a high powermode. A medium current limit and/or medium supply voltage can correspondto the medium power mode. Further, a low current limit and/or low supplyvoltage can correspond to the low power mode, all with appropriatebiasing controlled by bias control signal 196. In an embodiment of thepresent invention, bias control generator 194 receives control signal169 as a digital input that is used by analog or digital circuitry, suchas a processor, shared processor, state machine, logic array, or othercircuitry to generate the bias control signal 196 as an analog voltagethat biases one or more elements such as power transistors, output stagetransistors or other circuit elements of power amplifier 190 to conformto the selected mode.

While power amplifier module 197 is shown as off-chip, power amplifiermodule 197 can, in an alternative embodiment of the present invention beimplemented on voice data RF IC 50 or 70.

FIG. 7 is a schematic block diagram of another embodiment of a radiotransmitter front-end and power amplifier module in accordance with thepresent invention. This embodiment includes several common elements thatfrom FIG. 6 that are referred to by common reference numerals. However,power amplifier module 199 includes two or more power amplifiers 190that are driven by separate drivers 192 of radio transmitter front end150, that are each designed for one or more different modes ofoperation. Based on the particular mode or operation, one or another ofthe plurality of power amplifiers is utilized, with switching network198 coupling transmit signal 155 from one of the plurality of poweramplifiers 190 in response to the control signal 169, based on either RFsignal 182 or RF signal 182′. The bias control generator 194 generates abias control signal (196 or 196′) to a selected one of the plurality ofpower amplifiers in response to the control signal 169. In addition,power management circuit 95 or 95′ generates power supply signals 192 tothe off-chip power amplifier module 199 for powering a selected one ofthe plurality of power amplifiers 190, in response to the at least onecontrol signal 169. In this fashion, only the particular power amplifier190 that is in use is powered in order to conserve power. As with poweramplifier module 197, power amplifier module 199 can optionally beimplemented on voice data and RF IC 50 or 70.

FIG. 8 is a schematic block diagram of an embodiment of power managementcircuitry in accordance with the present invention. In particular,selected modules of voice data RF IC 50 or 70 are shown that includeprocessing module 225, memory module 230, and clock signal generator202. In an embodiment of the present invention, memory module 230 storesa least one application, such as application 232 and/or application 234that may include any of the applications discussed in conjunction withFIGS. 1-4, as well as other interface applications, system utilities, orother programs executed by processing module 225 to perform thefunctions and features of communication device 10 or 30. Theseapplications are stored in memory module 230 and/or an off-chip memorysuch as memory 54, as a plurality of operational instructions. Dependingon which application is being executed by the processing module 225, theuse characteristics of that application at a given time or theparticular application being executed may be used to determine a modethat corresponds to a power level or range or power levels, or awireless communication standard to be used for the RF transmitter 129.

Off-chip power management circuit 95 receives the control signal 169 aspart of power mode signals 208 and generates a plurality of power supplysignals 204 to power off-chip modules and on-chip modules that arecurrently in use and at least one selected transmitter power supplysignal that is based on the control signal 169 and the current powermode or RF transmitter 129. For example, the various power modes of RFtransmitter 129 can include a low, medium and high power ranges of powerlevels. Control signal 169, included in power mode signals 208, caninform the off-chip power management circuit of the selected power modeof the RF transmitter 129 so that off-chip power management circuit 95can supply the necessary power supply signals 204 to meet the powerdemands of the selected mode of operation. This methodology allows powerto be generated for the RF transmitter, only as required to address thecurrent power mode in use.

Also, if communication device 10 or 30 is using certain peripheraldevices and/or certain interfaces or modules at a given time, off-chippower management circuit 95 can be commanded to supply only those powersupply signals 204 that are required based on the peripheral devices,interfaces and/or other modules that are in use. Further, if a USBdevice is coupled to wireline port 64, then a power mode command can besent to off-chip power management module 95 to generate a power supplysignal 204 that supplies a power supply voltage, (such as a 5 volt, 8milliamp supply voltage) to the wireline port 64 in order to power theUSB device or devices connected thereto. In another example, if thecommunication device 10 includes a mobile communication device thatoperates in accordance with a GSM or EDGE wireless protocol, theoff-chip power management circuit 95 can generate supply voltages forthe baseband and RF modules of the transceiver only when the transceiveris operating.

Further, peripheral devices, such as the camera 76, memory 54,keypad/keyboard 58, microphone 60, display 56, and speaker 62 can bepowered when these peripheral devices are attached (to the extent thatthey can be detached) and to the extent that these devices are currentlyin use by the application.

The power management features of the present invention operate based onthe processing module determining, for the current application beingexecuted with corresponding current use characteristics, the currentpower mode of a plurality of power modes. In particular, processingmodule 225 when executing the application, selects a current power modebased on current use characteristics of the application, and generates apower mode signal 208 based on the selected power modes. In anembodiment of the present invention, processing module 225 maintains aregister that indicates for a plurality of modules, interfaces and/orperipheral devices either, whether that device is currently being usedor a power flag, such as power off, power on, high power, low power,medium power, etc, for that particular device, module and/or interface(when these devices are themselves capable in operating in differentpower modes). In addition, processing module, via look-up table,calculation or other processing routine, determines power mode 208 bydetermining the particular power supply signals required to be generatedbased on the devices in use and optionally their own power states.

The off-chip power management circuit 95 can be implemented as amulti-output programmable power supply, that receives the power modesignal 208 and generates and optionally routes the power supply signals204 to particular ports, pins or pads of voice data RF IC 50 or 70 ordirectly to peripheral devices via a switch matrix, as commanded basedon the power mode signal. In an embodiment of the present invention, thepower mode signal 208 is decoded by the off-chip power management moduleto determine the particular power supply signals to be generated, andoptionally—their characteristics such as voltage, current and/or currentlimit. As shown, voice data RF IC 50 or 70 optionally generates a clocksignal 206 via clock signal generator 202, or otherwise couples a clocksignal 206 generated off-chip to the off-chip power management circuit95. The off-chip power management circuit 95 operates based on the clocksignal 206.

In an embodiment of the present invention, voice data RF IC 50 or 70couples the power mode signal 208 to the off-chip power managementcircuit 95 via one or more dedicated digital lines that comprise aparallel interface. Further, the voice data RF IC 50 or 70 can couplethe power mode signal 208 to the off-chip power management circuit via aserial communication interface such as an I²C interface,serial/deserializer (SERDES) interface or other serial interface.

FIG. 9 is a schematic block diagram of another embodiment of powermanagement circuitry in accordance with the present invention. Thisembodiment includes similar elements described in conjunction with FIG.8 that are referred to by common reference numerals. In particular,on-chip power management circuit 95′ includes one or more DC-DCconverters, voltage regulators, current regulators or other powersupplies for supplying the voice data RF IC 50 or 70, and optionally theother components of communication device 10 and/or its peripheraldevices with supply voltages and or currents (collectively power supplysignals) that may be required to power these devices. On-chip powermanagement circuit 95′ can operate from one or more batteries, linepower and/or from other power sources, not shown. In particular, on-chippower management module 95′ can selectively supply power supply signalsof different voltages, currents or current limits or with adjustablevoltages, currents or current limits in response to power mode signals208 received from processing module 225. In this fashion, on-chip powermanagement circuit 95′ operates as off-chip power management module 95,but on an on-chip basis.

FIG. 10 is a side view of a pictorial representation of an embodiment ofan integrated circuit package in accordance with the present invention.Voice data and RF IC 325, such as voice data and RF IC 50 or 70,includes a system on a chip (SoC) die 300, a memory die 302 a substrate306, bonding pads 308 and power management unit (PMU) 308, such ason-chip power management circuit 95′. This figure is not drawn to scale,rather it is meant to be a pictorial representation that illustrates thejuxtaposition of the SoC die 300, memory die 302, PMU 304 and thebonding pads 308. In particular, the voice data and RF IC 325 isintegrated in a package with a top and a bottom having a plurality ofbonding pads 308 to connect the voice data and RF IC 325 to a circuitboard, and wherein the on-chip power management unit 325 is integratedalong the bottom of the package. In an embodiment of the presentinvention, die 302 includes the memory module 230 and die 300 includesthe processing module 225. These dies are stacked and die bonding isemployed to connect these two circuits and minimize the number ofbonding pads, (balls) out to the package. Both SoC die 300 and memorydie 302 are coupled to respective ones of the bonding pads 308 viabonding wires or other connections.

PMU 304 is coupled to the SoC die 300, and/or the memory die 302 viaconductive vias, bonding wires, bonding pads or by other connections.The positioning of the PMU on the bottom of the package in a flip chipconfiguration allows good heat dissipation of the PMU 304 to a circuitboard when the voice data and RF integrated circuit is installed.

FIG. 11 is a bottom view of a pictorial representation of an embodimentof an integrated circuit package in accordance with the presentinvention. As shown, the bonding pads (balls) 308 are arrayed in an areaof the bottom of the integrated circuit with an open center portion 310and wherein the on-chip power management unit (PMU 304) is integrated inthe open center portion. While a particular pattern and number ofbonding pads 308 are shown, a greater or lesser number of bonding padscan likewise be employed with alternative configurations within thebroad scope of the present invention.

FIG. 12 is a flow chart of an embodiment of a method in accordance withthe present invention. In particular, a method is presented for use inconjunction with one or more of the functions and features described inconjunction with FIGS. 1-12. In step 400, an RF signal is generated inan integrated circuit. In step 402, a transmit signal is generated fromthe RF signal in an off-chip power amplifier module. In step 404, aleast one application is stored as a plurality of operationalinstructions, the at least one application having a plurality of modesthat each correspond to one of a plurality of use characteristics. Instep 406, a selected one of the plurality of modes is selected based oncurrent use characteristics of the at least one application. In step408, at least one control signal is generated based on the selected oneof the plurality of modes. In step 410, a bias control signal isgenerated in response to the at least one control signal to control thebiasing of the off-chip power amplifier module.

In an embodiment of the present invention, step 410 generates a biascontrol signal to a selected one of the plurality of power amplifiers inresponse to the at least one control signal. Further, the plurality ofmodes can include a high power mode and a low power mode and/or a firstwireless mode corresponding to a first wireless standard and a secondwireless mode corresponding to a second wireless standard.

FIG. 13 is a flow chart of an embodiment of a method in accordance withthe present invention. In particular, a method is presented that can beused in conjunction with the method of FIG. 12. In addition, the methodincludes step 500 of generating a plurality of power supply signalsincluding at least one off-chip power amplifier power supply signal, inresponse to the at least one control signal.

FIG. 14 is a flow chart of an embodiment of a method in accordance withthe present invention. In particular, a method is presented that can beused in conjunction with the method of FIGS. 12-13, wherein the off-chippower amplifier module includes a plurality of power amplifiers and aswitching network coupled to the plurality of power amplifiers. Thismethod further includes step 510 of selectively coupling the transmitsignal from one of the plurality of power amplifiers in response to theat least one control signal.

FIG. 15 is a flow chart of an embodiment of a method in accordance withthe present invention. In particular, a method is presented that can beused in conjunction with the method of FIGS. 12-14. In addition, themethod includes step 520 of generating a plurality of power supplysignals including at least one off-chip power amplifier power supplysignal for powering a selected one of the plurality of power amplifiers,in response to the at least one control signal.

As may be used herein, the terms “substantially” and “approximately”provides an industry-accepted tolerance for its corresponding termand/or relativity between items. Such an industry-accepted toleranceranges from less than one percent to fifty percent and corresponds to,but is not limited to, component values, integrated circuit processvariations, temperature variations, rise and fall times, and/or thermalnoise. Such relativity between items ranges from a difference of a fewpercent to magnitude differences. As may also be used herein, theterm(s) “coupled to” and/or “coupling” and/or includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for indirect coupling, theintervening item does not modify the information of a signal but mayadjust its current level, voltage level, and/or power level. As mayfurther be used herein, inferred coupling (i.e., where one element iscoupled to another element by inference) includes direct and indirectcoupling between two items in the same manner as “coupled to”. As mayeven further be used herein, the term “operable to” indicates that anitem includes one or more of power connections, input(s), output(s),etc., to perform one or more its corresponding functions and may furtherinclude inferred coupling to one or more other items. As may stillfurther be used herein, the term “associated with”, includes directand/or indirect coupling of separate items and/or one item beingembedded within another item. As may be used herein, the term “comparesfavorably”, indicates that a comparison between two or more items,signals, etc., provides a desired relationship. For example, when thedesired relationship is that signal 1 has a greater magnitude thansignal 2, a favorable comparison may be achieved when the magnitude ofsignal 1 is greater than that of signal 2 or when the magnitude ofsignal 2 is less than that of signal 1.

The present invention has also been described above with the aid ofmethod steps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claimed invention.

The present invention has been described above with the aid offunctional building blocks illustrating the performance of certainsignificant functions. The boundaries of these functional buildingblocks have been arbitrarily defined for convenience of description.Alternate boundaries could be defined as long as the certain significantfunctions are appropriately performed. Similarly, flow diagram blocksmay also have been arbitrarily defined herein to illustrate certainsignificant functionality. To the extent used, the flow diagram blockboundaries and sequence could have been defined otherwise and stillperform the certain significant functionality. Such alternatedefinitions of both functional building blocks and flow diagram blocksand sequences are thus within the scope and spirit of the claimedinvention. One of average skill in the art will also recognize that thefunctional building blocks, and other illustrative blocks, modules andcomponents herein, can be implemented as illustrated or by discretecomponents, application specific integrated circuits, processorsexecuting appropriate software and the like or any combination thereof.

1. A voice data and radio frequency (RF) integrated circuit (IC)comprising: an RF transmitter, that generates an RF signal to a poweramplifier module wherein the power amplifier module includes a pluralityof power amplifiers and a switching network coupled to the plurality ofpower amplifiers, the switching network coupling a transmit signal froma selected one of the plurality of power amplifiers in response to atleast one control signal; a processing module, coupled to the poweramplifier module, that generates the at least one control signal basedon a selected one of a plurality of modes, wherein the plurality ofmodes include a first wireless mode corresponding to the use of the RFICin accordance with a first wireless standard and a second wireless modecorresponding to the use of the RFIC in accordance with a secondwireless standard; and a power management circuit, coupled to theprocessing module and the power amplifier module, that generates aplurality of power supply signals including at least one power supplysignal for selectively powering only the selected one of the pluralityof power amplifiers, in response to the at least one control signal,wherein the power management circuit is bonded to a bottom of the RFICso as to dissipate heat to a printed circuit board.
 2. The voice dataand RF IC of claim 1 wherein the bottom of the RFIC further includes aplurality of bonding elements for providing electrical connections tothe printed circuit board.
 3. The voice data and RF IC of claim 1further comprising: a memory module, coupled to the processing module,that stores a plurality of operational instructions of at least oneapplication.
 4. The voice data and RF IC of claim 3 wherein theprocessing module executes the plurality of operational instructions andfurther determines the selected one of the plurality of modes based oncurrent use characteristics of the at least one application.
 5. Thevoice data and RF IC of claim 1 further comprising: a bias controlgenerator, coupled to the processing module and the power amplifiermodule, that generates a bias control signal in response to the at leastone control signal, to control the biasing of the power amplifier moduleto a first bias for the first wireless mode and to a second bias for thesecond wireless mode, wherein the bias control generator generates abias control signal to the selected one of the plurality of poweramplifiers in response to the at least one control signal.
 6. The voicedata and RF IC of claim 1 wherein the plurality of modes further includea high power mode and a low power mode.
 7. A communication devicecomprising: an radio frequency (RF) transmitter included in an RFintegrated circuit (IC), that generates an RF signal; an off-chip poweramplifier module, coupled to the RF transmitter, that generates atransmit signal from the RF signal, wherein the off-chip power amplifiermodule includes a plurality of power amplifiers and a switching networkcoupled to the plurality of power amplifiers, the switching networkcoupling a transmit signal from a selected one of the plurality of poweramplifiers in response to at least one control signal; a processingmodule, coupled to the off-power amplifier module, that generates the atleast one control signal based on a selected one of a plurality ofmodes, wherein the plurality of modes include a first wireless modecorresponding to the use of the RFIC in accordance with a first wirelessstandard and a second wireless mode corresponding to the use of the RFICin accordance with a second wireless standard; and a power managementcircuit, coupled to the processing module and the power amplifiermodule, that generates a plurality of power supply signals including atleast one power supply signal for selectively powering only the selectedone of the plurality of power amplifiers, in response to the at leastone control signal, wherein the power management circuit is bonded to abottom of the RFIC so as to dissipate heat to a printed circuit board.8. The communication device of claim 7 wherein the bottom of the RFICfurther includes a plurality of bonding elements for providingelectrical connections to the printed circuit board.
 9. Thecommunication device of claim 7 further comprising: a memory module,coupled to the processing module, that stores a plurality of operationalinstructions of at least one application.
 10. The communication deviceof claim 9 wherein the processing module executes the plurality ofoperational instructions and further determines the selected one of theplurality of modes based on current use characteristics of the at leastone application.
 11. The communication device of claim 7 furthercomprising: a bias control generator, coupled to the processing moduleand the off-chip power amplifier module, that generates a bias controlsignal in response to the at least one control signal, to control thebiasing of the power amplifier module to a first bias for the firstwireless mode and to a second bias for the second wireless mode, whereinthe bias control generator generates a bias control signal to theselected one of the plurality of power amplifiers in response to the atleast one control signal.
 12. The communication device of claim 7wherein the plurality of modes further include a high power mode and alow power mode.